Product Description
Low bleed, silicone fluid-based heatsink compound for electrical and electronic use
Description
CHEMPLEX 1381 DE SINK COMPOUND is a silicone fluid-based, grease-like material specially blended with fine thermally conductive metal oxide powders. This formulation results in very high thermal conductivity, low bleed and excellent high temperature stability. This highly viscous product will not harden, melt or dry out and will tenaciously adhere to metal surfaces even when exposed to high temperatures for extended periods of time.
Features/ Benifits:
- very high thermal conductivity
- excellent high temperature stability
- low bleed
- will not harden, melt or dry out
Field of application
CHEMPLEX 1381 DE HEAT SINK COMPOUND is commonly used as an interface to facilitate the transfer of heat from one area to another as well as to even out temperatures from local high temperature areas by conducting heat to larger cooler areas. Used on transistors, diodes, rectifiers and transformers.
Method of application
Various methods including automated pumping systems, by hand, brushing, or wiping. If the container shows excess oil, mix thoroughly until oil is dispersed.
Industries
- Other industries
